FBGA Test Chip Packaging (3 units) - 261184

Tender Summary

The Korea Institute of Science and Technology in Korea from Asian region has released this tender for FBGA Test Chip Packaging (3 units) - 261184 with tender notice no. R26BK01735028 published on 18 Sep 2026. The tender is due to expire on 23 Sep 2026. This tender is sourced from G2b Korea and is eligible for suppliers interested in Integrated circuit packages, Packaging and related services, Packaging services, Medical Packaging. Interested bidders can obtain further information including complete bid documents or ways to participate by registering on Tender Impulse and referencing via Tender Impulse ID 14878800.

Tender Details

Tender NoticeTI Ref: 14878800
Tender Notice No
R26BK01735028
Tender Organisation
Korea Institute of Science and Technology
Tender Service
Worldwide
Tender Region
Tender Project Location
Tender CPV
31712117 : Integrated circuit packages79920000 : Packaging and related services79921000 : Packaging services982318209 : Medical Packaging
Tender Source
G2b Korea
Tender Document Type
Tender Notice
Tender Deadline
23 Sep 2026 4 days left
Tender Description
FBGA Test Chip Packaging (3 units) - 261184
Tender Bidding Type

Frequently Asked Questions About This Tender

Who has issued this tender, and what is it for?
The tender has been issued by Korea Institute of Science and Technology in Korea. Such a type of tender falls under Integrated circuit packages, Packaging and related services, Packaging services, Medical Packaging, within the Management Consultancy sector, and is listed on Tender Impulse under notice number R26BK01735028.
What are the key dates for this tender?
The notice was published on 18 Sep 2026 and submissions close on 23 Sep 2026. Late bids are rarely accepted in public procurement, so aim to have your documents ready several days before the closing date.
Which CPV codes apply to this tender?
It is classified under CPV codes 31712117, 79920000, 79921000, 982318209, which correspond to Integrated circuit packages, Packaging and related services, Packaging services, Medical Packaging. If your company supplies these products or services, these are the codes to save in your alert profile so no matching tender passes you by.
Can I submit my bid for this tender to Tender Impulse?
No - and this matters. Tender Impulse is a tender aggregation and alert service: we collect procurement notices from official sources around the world and list them in one place. We do not receive, forward or evaluate bids. Your bid for this tender must be submitted directly to Korea Institute of Science and Technology, using the method described in the original tender document, before 23 Sep 2026. Tender Impulse provides complete assistance in submitting all bids posted on its website.
How do I get the bid documents and participation details?
Request a live demo on Tender Impulse and our tender experts will walk you through this listing, share the available documents, and explain how to submit your bid to Korea Institute of Science and Technology. Subscribers also receive help with registration requirements and, where needed, translation of non-English notices - but the submission itself always goes from you to the buyer.
How can I find more tenders like this in Korea?
There are currently 8292 live tenders of 1376214 total tenders from Korea on Tender Impulse. You can browse them on our Korea tenders page, or save a search combining Korea with CPV codes 31712117, 79920000, 79921000, 982318209 - we will then email you every new match on the day it is published.
How to prepare for this bid?
Suppliers must verify technical specifications, the delivery schedules and any other intrinsic details as provided in the complete bid documents before deciding to submit their bids. All necessary certifications and supplier registrations must be undertaken before participation.
Is this tender beneficial for me?
The procurement is applicable to companies in the Integrated circuit packages, Packaging and related services, Packaging services, Medical Packaging and related industries. If you belong to this industry, you can review the technical documents before assessing your relevance to your company.
What is the procurement trend for FBGA Test Chip Packaging (3 units) - 261184?
The public procurement trends for FBGA Test Chip Packaging (3 units) - 261184 can be assessed by viewing historical data and buying patterns for this product. Subscribed members can view and even download reports of tenders released in the past for their market research. This shall allow them to carefully prepare a compelling bid.

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